| 1 |
Conformation-dependent ligand regulation of ATP hydrolysis by human KSP: Activation of basal hydrolysis and inhibition of microtubule-stimulated hydrolysis by a single, small molecule modulator
Luo LS, Carson JD, Molnar KS, Tuske SJ, Coales SJ, Hamuro Y, Sung CM, Sudakin V, Auger KR, Dhanak D, Jackson JR, Huang PS, Tummino PJ, Copeland RA
Journal of the American Chemical Society, 130(24), 7584, 2008 |
| 2 |
Fabrication of CuSiC metal matrix composites
Sundberg G, Paul P, Sung CM, Vasilos T
Journal of Materials Science, 41(2), 485, 2006 |
| 3 |
Identification and characterization of diffusion barriers for Cu/SiC systems
Sundberg G, Paul P, Sung CM, Vasilos T
Journal of Materials Science, 40(13), 3383, 2005 |
| 4 |
The Morphology of Electrospun Polystyrene Fibers
Kim GT, Hwang YJ, Ahn YC, Shin HS, Lee JK, Sung CM
Korean Journal of Chemical Engineering, 22(1), 147, 2005 |
| 5 |
Investigation of Pore Formation for Polystyrene Electrospun Fiber: Effect of Relative Humidity
Kim GT, Lee JS, Shin JH, Ahn YC, Hwang YJ, Shin HS, Lee JK, Sung CM
Korean Journal of Chemical Engineering, 22(5), 783, 2005 |
| 6 |
Enzymatic copolymerization alters the structure of unpolymerized mixtures of the biomimetic monomers: The amphiphilic decyl ester of L-tyrosine and L-tyrosineamide-an AFM investigation of nano- to micrometer-scale structure differences
Marx KA, Lee JS, Sung CM
Biomacromolecules, 5(5), 1869, 2004 |
| 7 |
Electrospinning of polycarbonate nanofibers with solvent mixtures THF and DMF
Shawon J, Sung CM
Journal of Materials Science, 39(14), 4605, 2004 |
| 8 |
Morphological study of electrospun polycarbonates as a function of the solvent and processing voltage
Krishnappa RVN, Desai K, Sung CM
Journal of Materials Science, 38(11), 2357, 2003 |
| 9 |
Silicon nitride matrix composites with unidirectional silicon carbide whisker reinforcement
Go P, Sung CM, Kostetsky JJ, Vasilos T
Journal of Materials Science, 37(12), 2587, 2002 |
| 10 |
Internal stresses and microstructures of commercial thick diamond films deposited by different deposition methods
Kuo CT, Wu JY, Lin CH, Lu TR, Sung CM
Materials Chemistry and Physics, 72(2), 114, 2001 |
