검색결과 : 6건
| No. | Article |
|---|---|
| 1 |
Electrochemical Potential Measurements During the Chemical-Mechanical Polishing of Copper Thin-Films Steigerwald JM, Duquette DJ, Murarka SP, Gutmann RJ Journal of the Electrochemical Society, 142(7), 2379, 1995 |
| 2 |
Mechanisms of Copper Removal During Chemical-Mechanical Polishing Steigerwald JM, Murarka SP, Ho J, Gutmann RJ, Duquette DJ Journal of Vacuum Science & Technology B, 13(6), 2215, 1995 |
| 3 |
Integration of Copper Multilevel Interconnects with Oxide and Polymer Interlevel Dielectrics Gutmann RJ, Chow TP, Lakshminarayanan S, Price DT, Steigerwald JM, You L, Murarka SP Thin Solid Films, 270(1-2), 472, 1995 |
| 4 |
Chemical-Mechanical Polishing of Copper with Oxide and Polymer Interlevel Dielectrics Gutmann RJ, Steigerwald JM, You L, Price DT, Neirynck J, Duquette DJ, Murarka SP Thin Solid Films, 270(1-2), 596, 1995 |
| 5 |
Pattern Geometry-Effects in the Chemical-Mechanical Polishing of Inlaid Copper Structures Steigerwald JM, Zirpoli R, Murarka SP, Price D, Gutmann RJ Journal of the Electrochemical Society, 141(10), 2842, 1994 |
| 6 |
Effect of Copper Ions in the Slurry on the Chemical-Mechanical Polish Rate of Titanium Steigerwald JM, Murarka SP, Gutmann RJ, Duquette DJ Journal of the Electrochemical Society, 141(12), 3512, 1994 |