1 |
Experimental study by Secondary Ion Mass Spectrometry focused on the relationship between hardness and sputtering rate in hard coatings Onorati E, Iacob E, Bartali R, Barozzi M, Gennaro S, Bersani M Thin Solid Films, 625, 35, 2017 |
2 |
Improvement of depth resolution in XPS analysis of fluorinated layer using C-60 ion sputtering Nobuta T, Ogawa T Applied Surface Science, 256(5), 1560, 2009 |
3 |
A Study on MgO Characteristics of AC Plasma Display Panel Fabricated by Vacuum Sealing Method Park CS, Tae HS, Kwon YK, Heo EG Molecular Crystals and Liquid Crystals, 499, 546, 2009 |
4 |
Accuracy of calibrated depth by delta-doped reference materials in shallow depth profiling Tomita M, Tanaka H, Koike M, Kinno T, Hori Y, Yoshida N, Sasaki T, Takeno S Applied Surface Science, 255(4), 1311, 2008 |
5 |
Evaluation of sputtering rate change in the silicon transient region under medium energy O-2(+) sputtering Takano A, Takenaka H Applied Surface Science, 255(4), 1348, 2008 |
6 |
The optimization of incident angles of low-energy oxygen ion beams for increasing sputtering rate on silicon samples Sasaki T, Yoshida N, Takahashi M, Tomita M Applied Surface Science, 255(4), 1357, 2008 |
7 |
A study of fused silica micro/nano patterning by focused-ion-beam Li WX, Lalev G, Dimov S, Zhao H, Pham DT Applied Surface Science, 253(7), 3608, 2007 |
8 |
Surface chemistry and optimization of focused ion beam iodine-enhanced etching of indium phosphide Callegari V, Nellen PM, Yang TH, Hauert R, Muller U, Hernandez-Ramirez F, Sennhauser U Applied Surface Science, 253(22), 8969, 2007 |
9 |
Electron irradiation effect on depth profiling of a SiO2/Si(100) surface by Auger electron spectroscopy Yakabe T, Fujita D, Yoshihara K Applied Surface Science, 241(1-2), 127, 2005 |
10 |
AES depth profiling and interface analysis of C/Ta bilayers Zalar A, Kovac J, Pracek B, Hofmann S, Panjan P Applied Surface Science, 252(5), 2056, 2005 |