| 1 |
Wetting behaviours and interfacial characteristics of Co-binder sintered polycrystalline diamond by Sn-Ti active solder
He QQ, Zhang YB, Duan N, Huang H, Mu DK, Liao XJ
Powder Technology, 376, 643, 2020 |
| 2 |
Performance comparison of medium temperature domestic packed bed latent heat storage systems
Mawire A, Lefenya TM, Ekwomadu CS, Lentswe KA, Shobo AB
Renewable Energy, 146, 1897, 2020 |
| 3 |
Role of reinforcement surface treatment on the SnAg3Cu0.5 microelectronic joints
Gyoker Z, Gergely G, Horvath DK, Bodnar E, Gacsi Z
Applied Surface Science, 475, 982, 2019 |
| 4 |
Fabrication and thermal behavior of Al/Fe2O3 energetic composites for effective interfacial bonding between dissimilar metallic substrates
Kim JH, Cho MH, Shim HM, Kim SH
Journal of Industrial and Engineering Chemistry, 78, 84, 2019 |
| 5 |
Numerical analysis on thermal crack initiation due to non-homogeneous solder coating on the round strip interconnection of photo-voltaic modules
Mjad AE, Ekere NN
Solar Energy, 194, 649, 2019 |
| 6 |
Geometrical effects on growth kinetics of interfacial intermetallic compounds in Sn/Cu joints reflowed with Cu nanoparticles doped flux
Shang SY, Kunwar A, Yao JY, Ma HT, Wang YP
Thin Solid Films, 669, 198, 2019 |
| 7 |
Characterization of reflow soldering at a peak temperature of 215 degrees C using a Bi-coated Sn-3.0Ag-0.5Cu solder ball
Hwang JH, Lee JH
Applied Surface Science, 454, 227, 2018 |
| 8 |
Effect of aluminum micro- and nanoparticles on ignition and combustion properties of energetic composites for interfacial bonding of metallic substrates
Kim KJ, Cho MH, Kim SH
Combustion and Flame, 197, 319, 2018 |
| 9 |
Corrosion behavior assessment of tin-lead and lead free solders exposed to fire smoke generated by burning polyvinyl chloride
Li Q, Liu XF, Lu SX
Materials Chemistry and Physics, 212, 298, 2018 |
| 10 |
In situ study on the effect of Cu5Zn8 intermetallic layer on the Cu-Ni cross interaction in Cu/Sn-9Zn/Ni interconnect under temperature gradient
Zhong Y, Zhao N, Dong W, Wang YP, Ma HT
Materials Chemistry and Physics, 216, 130, 2018 |
