검색결과 : 5건
No. | Article |
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1 |
Reliability Evaluation of Manufacturing Processes for Bipolar and MOS Devices on Silicon-on-Diamond Materials Edholm B, Soderbarg A, Bengtsson S Journal of the Electrochemical Society, 143(4), 1326, 1996 |
2 |
Modification of Silicon Surfaces with H2SO4-H2O2-HF and HNO3-HF for Wafer Bonding Applications Ljungberg K, Jansson U, Bengtsson S, Soderbarg A Journal of the Electrochemical Society, 143(5), 1709, 1996 |
3 |
The Effects of HF Cleaning Prior to Silicon-Wafer Bonding Ljungberg K, Backlund Y, Soderbarg A, Bergh M, Andersson MO, Bengtsson S Journal of the Electrochemical Society, 142(4), 1297, 1995 |
4 |
Characterization of Spontaneously Bonded Hydrophobic Silicon Surfaces Ljungberg K, Soderbarg A, Bengtsson S, Jauhiainen A Journal of the Electrochemical Society, 141(2), 562, 1994 |
5 |
Buried Cobalt Silicide Layers in Silicon Created by Wafer Bonding Ljungberg K, Soderbarg A, Tiensuu AL, Johansson S, Thungstrom G, Petersson CS Journal of the Electrochemical Society, 141(10), 2829, 1994 |