| 1 |
Heat capacities, entropies, and Gibbs free energies of formation of low-k amorphous Si(O)CH dielectric films and implications for stability during processing
Chen JW, Calvin J, Asplund M, King SW, Woodfield BF, Navrotsky A
Journal of Chemical Thermodynamics, 128, 320, 2019 |
| 2 |
Antimicrobial finishing of textiles intended for food processing industry by plasma enhanced chemical vapor deposition - physical vapor deposition of Ag-SiOCH composites coated with AlxOy or SiOCH encapsulation layers
Brunon C, Chadeau E, Oulahal N, Grossiord C, Dubost L, Simon F, Bessueille F, Degraeve P, Leonard D
Thin Solid Films, 628, 132, 2017 |
| 3 |
Thermodynamic Stability of Low-k Amorphous SiOCH Dielectric Films
Chen JW, King SW, Muthuswamy E, Koryttseva A, Wu D, Navrotsky A
Journal of the American Ceramic Society, 99(8), 2752, 2016 |
| 4 |
초임계이산화탄소를 이용한 플라즈마 손상된 다공성 저유전 막질의 복원
정재목, 임권택
Clean Technology, 16(3), 191, 2010 |
| 5 |
Multi-solvent ellipsometric porosimetry analysis of plasma-treated porous SiOCH films
Licitra C, Bouyssou R, Chevolleau T, Bertin F
Thin Solid Films, 518(18), 5140, 2010 |
| 6 |
Influence of polymer porogens on the porosity and mechanical properties of spin coated Ultra Low k dielectrics
Jousseaume V, Rolland G, Babonneau D, Simon JP
Thin Solid Films, 517(15), 4413, 2009 |
| 7 |
Thermal furnace and Ultraviolet assisted curing impact on SiOCH spin-on ultra low dielectric constant materials
Zenasnia A, Remiat B, Waldfiied C, Le Cornec C, Jousseaume V, Passemard G
Thin Solid Films, 516(6), 1097, 2008 |
| 8 |
Effects of various additive gases on chemical dry etching rate enhancement of low-k SiOCH layer in F-2/Ar remote plasmas
Yun YB, Park SM, Kim DJ, Lee NE, Choi CK, Kim KS, Bae GH
Thin Solid Films, 516(11), 3549, 2008 |
| 9 |
Control of reactive plasmas for low-k/Cu integration
Tatsumi T
Applied Surface Science, 253(16), 6716, 2007 |
| 10 |
Comparative study of porosity in low-k SiOCH thin films obtained at different deposition conditions
Brusa RS, Macchi C, Mariazzi S, Spagolla M, Karwasz GP, Zecca A
Materials Science Forum, 445-6, 268, 2004 |
