| 1 |
Effect of a Multi-Step Gap-Filling Process to Improve Adhesion between Low-K Films and Metal Patterns
Lee W, Kim TH, Choa YH
Korean Journal of Materials Research, 26(8), 427, 2016 |
| 2 |
Effects of shallow trench isolation on low frequency noise characteristics of source-follower transistors in CMOS image sensors
Kwon SK, Kwon HM, Choi WI, Song HS, Lee HD
Solid-State Electronics, 119, 29, 2016 |
| 3 |
Shallow trench isolation geometric influence of a recessed surface on array-type arrangements of nano-scaled devices strained by contact etch stop liner and Ge-based stressors
Hsieh CP, Liao MH, Lee CC, Cheng TC, Wang CP, Huang PC, Cheng SW
Thin Solid Films, 618, 172, 2016 |
| 4 |
Investigation of consequent process-induced stress for N-type metal oxide semiconductor field effect transistor with a sunken shallow trench isolation pattern
Lee CC, Liu CH, Deng RH, Hsu HW, Chiang KN
Thin Solid Films, 557, 323, 2014 |
| 5 |
Narrow gap filling in 25 nm shallow trench isolation using highly porous organosilica
Oh H, Kim JH, Jang J
Thin Solid Films, 562, 166, 2014 |
| 6 |
Design and optimization of high voltage LDMOS transistors on 0.18 mu m SOI CMOS technology
Toulon G, Cortes I, Morancho F, Hugonnard-Bruyere E, Villard B, Toren WJ
Solid-State Electronics, 61(1), 111, 2011 |
| 7 |
Shallow trench isolation-related narrow channel effect on the kink behaviour of 40 nm PD SOI NMOS device
Hung HJ, Kuo JB, Chen D, Tsai CT, Yeh C
Solid-State Electronics, 54(5), 609, 2010 |
| 8 |
Investigation of impact of shallow trench isolation on SONOS type memory cells
Xu Y, Yan F, Chen DJ, Shi Y, Li ZG, Yang F, Wang J, Wang YG, Lin P, Chang JG, Yi C
Solid-State Electronics, 54(12), 1644, 2010 |
| 9 |
Short-channel epitaxial germanium pMOS transistors
Eneman G, De Jaeger B, Wang G, Mitard J, Hellings G, Brunco DP, Simoen E, Loo R, Caymax M, Claeys C, De Meyer K, Meuris M, Heyns MM
Thin Solid Films, 518, S88, 2010 |
| 10 |
Fabrication of high quality Ge virtual substrates by selective epitaxial growth in shallow trench isolated Si (001) trenches
Wang G, Loo R, Takeuchi S, Souriau L, Lin JC, Moussa A, Bender H, De Jaeger B, Ong P, Lee W, Meuris M, Caymax M, Vandervorst W, Blanpain B, Heyns MM
Thin Solid Films, 518(9), 2538, 2010 |
