1 |
Numerical simulation of a high-temperature aquifer thermal energy storage system coupled with heating and cooling of a thermal plant in a cold region, China Xiao X, Jiang ZJ, Owen D, Schrank C Energy, 112, 443, 2016 |
2 |
Modification of wetting of copper (Cu) on carbon (C) by plasma treatment and molybdenum (Mo) interlayers Eisenmenger-Sittner C, Schrank C, Neubauer E, Eiper E, Keckes J Applied Surface Science, 252(15), 5343, 2006 |
3 |
Loss of adhesion strength of PVD Cu films on carbon substrates after heat treatment and correlated effects on the thermal interface properties Neubauer E, Chotikaprakhan S, Dietzel D, Bein BK, Pelzl J, Eisenmenger-Sittner C, Schrank C, Korb G Applied Surface Science, 252(15), 5432, 2006 |
4 |
Characterisation of molybdenum intermediate layers in Cu-C system with SIMS method Mayerhofer KE, Schrank C, Eisenmenger-Sittner C, Hutter H Applied Surface Science, 252(1), 266, 2005 |
5 |
Solid state de-wetting observed for vapor deposited copper films on carbon substrates Schrank C, Eisenmenger-Sittner C, Neubauer E, Bangert H, Bergauer A Thin Solid Films, 459(1-2), 276, 2004 |