검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Plasma etch-back planarization coupled to chemical mechanical polishing for sub 0.18 mu m shallow trench isolation technology Schiltz A, Palatini L, Paoli M, Rivoire M, Prola A Journal of Vacuum Science & Technology A, 18(4), 1313, 2000 |
| 2 |
Germanium etching in high density plasmas for 0.18 mu m complementary metal-oxide-semiconductor gate patterning applications Monget C, Schiltz A, Joubert O, Vallier L, Guillermet M, Tormen B Journal of Vacuum Science & Technology B, 16(4), 1833, 1998 |