검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
Effect of Retaining Ring Slot Design on Slurry Film Thickness during CMP Wei XM, Sampurno YA, Zhuang Y, Dittler R, Meled A, Cheng J, Wargo C, Stankowski R, Philipossian A Electrochemical and Solid State Letters, 13(4), H119, 2010 |
| 2 |
Analyses of Diamond Disk Substrate Wear and Diamond Microwear in Copper Chemical Mechanical Planarization Process Meled A, Zhuang Y, Wei X, Cheng J, Sampurno YA, Borucki L, Moinpour M, Hooper D, Philipossian A Journal of the Electrochemical Society, 157(3), H250, 2010 |
| 3 |
A method for direct measurement of substrate temperature during copper CMP Sampurno YA, Borucki L, Zhuang Y, Boning D, Philipossian A Journal of the Electrochemical Society, 152(7), G537, 2005 |