| 1 |
Effects Of Chemical And Physico-Chemical Surface Conditioning Methods On The Adhesion Of Resin Composite To Different Mineral Trioxide Aggregate Based Cements
Eyuboglu TF, Olcay K, Ozcan M
Journal of Adhesion Science and Technology, 33(16), 1836, 2019 |
| 2 |
Prime-and-rinse approach for improving the enamel micro-tensile bond strengths of self-etch adhesives
Wu ZF, Zheng HY, Ouyang Y, Li MX, Zhang LQ, Su JM, Fu BP
Journal of Adhesion Science and Technology, 33(8), 871, 2019 |
| 3 |
Evaluation of bonding effectiveness of a self-etch and an etch-and-rinse adhesive resin to un-treated and Er:Yag laser treated dentin using mini-interfacial fracture toughness test
Behroozibakhsh M, Davaie S, Monzavi A, Abazari T, Shahabi S, Pirmoradian M
Journal of Adhesion Science and Technology, 33(11), 1201, 2019 |
| 4 |
CFD modelling of axial mixing in the intermediate and final rinses of cleaning-in-place procedures of straight pipes
Yang JF, Jensen BBB, Nordkvist M, Rasmussen P, Gernaey KV, Kruhne U
Journal of Food Engineering, 221, 95, 2018 |
| 5 |
Rinse-resistant superhydrophobic block copolymer fabrics by electrospinning, electrospraying and thermally-induced self-assembly
Wu J, Li X, Wu Y, Liao GX, Johnston P, Topham PD, Wang LG
Applied Surface Science, 422, 769, 2017 |
| 6 |
Analysis of different current density conditions in the electrodialysis of zinc electroplating process solution
Bittencourt SD, Marder L, Benvenuti T, Ferreira JZ, Bernardes AM
Separation Science and Technology, 52(13), 2079, 2017 |
| 7 |
Application of electromembrane processes in chromium electroplating technology
Kruglikov SS
Petroleum Chemistry, 56(10), 969, 2016 |
| 8 |
High-temperature pressure swing adsorption cycle design for sorption-enhanced water-gas shift
Boon J, Cobden PD, van Dijk HAJ, Annaland MV
Chemical Engineering Science, 122, 219, 2015 |
| 9 |
CPP-ACP pretreatment effect on microshear bond strength of simplified etch-and-rinse adhesive systems plus a flowable composite to enamel
de Araujo DFG, Borges BCD, Mendes AM, Souza EJ, de Assuncao IV, dos Santos AJS
Journal of Adhesion Science and Technology, 29(2), 109, 2015 |
| 10 |
Computer modeling of surface interactions and contaminant transport in microstructures during the rinsing of patterned semiconductor wafers
Dodge MR, Shadman F
Computers & Chemical Engineering, 68, 182, 2014 |
