| 1 |
The Impact of Organic Additives on Copper Trench Microstructure
Marro JB, Okoro CA, Obeng YS, Richardson KC
Journal of the Electrochemical Society, 164(9), D543, 2017 |
| 2 |
The influence of pulse plating frequency and duty cycle on the microstructure and stress state of electroplated copper films
Marro JB, Darroudi T, Okoro CA, Obeng YS, Richardson KC
Thin Solid Films, 621, 91, 2017 |
| 3 |
Computational Modeling of Die Swell of Extruded Glass Preforms at High Viscosity
Trabelssi M, Ebendorff-Heidepriem H, Richardson KC, Monro TM, Joseph PF
Journal of the American Ceramic Society, 97(5), 1572, 2014 |
| 4 |
Thermo-mechanical characterization of glass at high temperature using the cylinder compression test. Part I: Viscoelasticity, friction, and PPV
Joshi D, Mosaddegh P, Musgraves JD, Richardson KC, Joseph PF
Journal of Rheology, 57(5), 1367, 2013 |
| 5 |
Thermo-mechanical characterization of glass at high temperature using the cylinder compression test. Part II: No-slip experiments, viscoelastic constants, and sensitivity
Joshi D, Mosaddegh P, Musgraves JD, Richardson KC, Joseph PF
Journal of Rheology, 57(5), 1391, 2013 |
| 6 |
Correlation between physical, optical and structural properties of sulfide glasses in the system Ge-Sb-S
Petit L, Carlie N, Adamietz F, Couzi M, Rodriguez V, Richardson KC
Materials Chemistry and Physics, 97(1), 64, 2006 |
