검색결과 : 4건
| No. | Article |
|---|---|
| 1 |
Electromigration cu mass flow in cu interconnections Hu CK, Canaperi D, Chen ST, Gignac LM, Kaldor S, Krishnan M, Malhotra SG, Liniger E, Lloyd JR, Rath DL, Restaino D, Rosenberg R, Rubino J, Seo SC, Simon A, Smith S, Tseng WT Thin Solid Films, 504(1-2), 274, 2006 |
| 2 |
High temperature subatmospheric chemical vapor deposited undoped silicate glass - A solution for next generation shallow trench isolation Xia LQ, Nemani S, Galiano M, Pichai S, Chandran S, Yieh E, Cote D, Conti R, Restaino D, Tobben D Journal of the Electrochemical Society, 146(3), 1181, 1999 |
| 3 |
High aspect ratio trench filling using two-step subatmospheric chemical vapor deposited borophosphosilicate glass for < 0.18 mu m device application Xia LQ, Conti R, Galiano M, Campana F, Chandran S, Cote D, Restaino D, Yieh E Journal of the Electrochemical Society, 146(5), 1884, 1999 |
| 4 |
Recent Advances in the Application of Collimated Sputtering Vollmer B, Licata T, Restaino D, Ryan J Thin Solid Films, 247(1), 104, 1994 |