검색결과 : 17건
| No. | Article |
|---|---|
| 1 |
Advanced monitoring of the fouling process on water walls Reiche M, Grahl S, Beckmann M Fuel, 216, 436, 2018 |
| 2 |
Coherent X-Ray Diffraction Imaging and Characterization of Strain in Silicon-on-Insulator Nanostructures Xiong G, Moutanabbir O, Reiche M, Harder R, Robinson I Advanced Materials, 26(46), 7747, 2014 |
| 3 |
Experimental investigation of multilayer particle deposition and resuspension between periodic steps in turbulent flows Barth T, Reiche M, Banowski M, Oppermann M, Hampel U Journal of Aerosol Science, 64, 111, 2013 |
| 4 |
Glassy Dynamics in Condensed Isolated Polymer Chains Tress M, Mapesa EU, Kossack W, Kipnusu WK, Reiche M, Kremer F Science, 341(6152), 1371, 2013 |
| 5 |
Comparison of the top-down and bottom-up approach to fabricate nanowire-based Silicon/Germanium heterostructures Wolfsteller A, Geyer N, Nguyen-Duc TK, Das Anungo P, Zakharov ND, Reiche M, Erfurth W, Blumtritt H, Werner P, Gosele U Thin Solid Films, 518(9), 2555, 2010 |
| 6 |
Stress Adjustment and Bonding of H-Implanted 2 in. Freestanding GaN Wafer: The Concept of Double-Sided Splitting Moutanabbir O, Senz S, Scholz R, Christiansen S, Reiche M, Avramescu A, Strauss U, Gosele U Electrochemical and Solid State Letters, 12(4), H105, 2009 |
| 7 |
High-density-plasma (HDP)-CVD oxide to thermal oxide wafer bonding for strained silicon layer transfer applications Singh R, Radu I, Reiche M, Himcinschi C, Kuck B, Tillack B, Gosele U, Christiansen SH Applied Surface Science, 253(7), 3595, 2007 |
| 8 |
Uniaxially strained silicon by wafer bonding and layer transfer Himcinschi C, Radu I, Muster F, Singh R, Reiche M, Petzold M, Gosele U, Christiansen SH Solid-State Electronics, 51(2), 226, 2007 |
| 9 |
Ammonium hydroxide effect on low-temperature wafer bonding energy enhancement Chao YL, Tong QY, Lee TH, Reiche M, Scholz R, Woo JCS, Gosele U Electrochemical and Solid State Letters, 8(3), G74, 2005 |
| 10 |
Fabrication of monodomain alumina pore arrays with an interpore distance smaller than the lattice constant of the imprint stamp Choi J, Nielsch K, Reiche M, Wehrspohn RB, Gosele U Journal of Vacuum Science & Technology B, 21(2), 763, 2003 |