화학공학소재연구정보센터
검색결과 : 17건
No. Article
1 Papaya leaves extract as a novel eco-friendly corrosion inhibitor for Cu in H2SO4 medium
Tan BC, Xiang B, Zhang ST, Qiang YJ, Xu LH, Chen SJ, He JH
Journal of Colloid and Interface Science, 582, 918, 2021
2 Incorporation of electroconductive carbon fibers to achieve enhanced anti-corrosion performance of zinc rich coatings
Ge TH, Zhao WJ, Wu XD, Lan XJ, Zhang YG, Qiang YJ, He YL
Journal of Colloid and Interface Science, 567, 113, 2020
3 An intermittent microwave-exfoliated non-expansive graphite oxide process for highly-efficient production of high-quality graphene
Zou XF, Hao JY, Qiang YJ, Xiang B, Liang XY, Shen HJ
Journal of Colloid and Interface Science, 565, 288, 2020
4 Mn3O4/Co(OH)(2) cactus-type nanoarrays for high-energy-density asymmetric supercapacitors
Wang Y, Hao JY, Li WP, Zuo XL, Xiang B, Qiang YJ, Zou XF, Tan BC, Hu Q, Chen F
Journal of Materials Science, 55(2), 724, 2020
5 Understanding the adsorption and anticorrosive mechanism of DNA inhibitor for copper in sulfuric acid
Qiang YJ, Zhang ST, Wang LP
Applied Surface Science, 492, 228, 2019
6 Corrosion inhibition of X65 steel in sulfuric acid by two food flavorants 2-isobutylthiazole and 1-(1,3-Thiazol-2-yl) ethanone as the green environmental corrosion inhibitors: Combination of experimental and theoretical researches
Tan BC, Zhang ST, Liu HY, Guo YW, Qiang YJ, Li WP, Guo L, Xu CL, Chen SJ
Journal of Colloid and Interface Science, 538, 519, 2019
7 Facile electrochemical phosphatization of Mn3O4 nanosheet arrays for supercapacitor with enhanced performance
Hao JY, Li WP, Zuo XL, Zheng DD, Liang XY, Qiang YJ, Tan BC, Xiang B, Zou XF
Journal of Materials Science, 54(1), 625, 2019
8 Effects of 2,2-Dithiodipyridine as a Leveler for Through-Holes Filling by Copper Electroplating
Wang X, Zhang ST, Chen SJ, Tan BC, Guo HL, Wang Y, Qiang YJ, Fu SL, Wen YN
Journal of the Electrochemical Society, 166(13), D660, 2019
9 Self-assembly porous metal-free electrocatalysts templated from sulfur for efficient oxygen reduction reaction
Xiang Q, Li S, Zou XF, Qiang YJ, Hu BB, Cen Y, Xu CL, Liu LJ, Zhou Y, Chen CG
Applied Surface Science, 462, 65, 2018
10 Improving interfacial adhesion between copper foil and resin using amino acid in printed circuit board industry
Luo L, Zhang ST, Qiang YJ, Bozdag I, Chen SJ, Tang MX, Gao JY, Qin ZJ
Journal of Adhesion Science and Technology, 32(13), 1452, 2018