화학공학소재연구정보센터
검색결과 : 10건
No. Article
1 Long-term CO2 capture tests of Pd-based composite membranes with module configuration
Lee CB, Lee SW, Park JS, Lee DW, Hwang KR, Ryi SK, Kim SH
International Journal of Hydrogen Energy, 38(19), 7896, 2013
2 Fabrication and characterization of Pd/Nb40Ti30Ni30/Pd/porous nickel support composite membrane for hydrogen separation and purification
Xiong LY, Liu S, Rong LJ
International Journal of Hydrogen Energy, 35(4), 1643, 2010
3 Low temperature diffusion bonding of Pd-based composite membranes with metallic module for hydrogen separation
Ryi SK, Park JS, Kim SH, Kim DW, Kim HK
Journal of Membrane Science, 326(2), 589, 2009
4 Formation of a defect-free Pd-Cu-Ni ternary alloy membrane on a polished porous nickel support (PNS)
Ryi SK, Park JS, Kim SH, Kim DW, Cho KI
Journal of Membrane Science, 318(1-2), 346, 2008
5 A new membrane module design with disc geometry for the separation of hydrogen using Pd alloy membranes
Ryi SK, Park JS, Kim SH, Cho SUH, Hwang KR, Kim DW, Kim HG
Journal of Membrane Science, 297(1-2), 217, 2007
6 Long-term hydrogen permeation tests of Pd-Cu-Ni/PNS with temperature cycles from room temperature to 773 K
Ryi SK, Park JS, Kim SH, Kim DW, Moon JW
Journal of Membrane Science, 306(1-2), 261, 2007
7 Development of a new porous metal support of metallic dense membrane for hydrogen separation
Ryi SK, Park JS, Kim SH, Cho SH, Park JS, Kim DW
Journal of Membrane Science, 279(1-2), 439, 2006
8 The effect of support resistance on the hydrogen permeation behavior in Pd-Cu-Ni ternary alloy membrane deposited on a porous nickel support
Ryi SK, Park JS, Kim SH, Cho SH, Kim DW
Journal of Membrane Science, 280(1-2), 883, 2006
9 Cu Reflow를 이용한 Pd-Cu-Ni 합금 수소분리막 특성
김동원, 김흥구, 엄기연, 김상호, 이인선, 박종수, 이신근
Korean Chemical Engineering Research, 44(2), 160, 2006
10 Characterization of Pd-Cu-Ni ternary alloy membrane prepared by magnetron sputtering and Cu-reflow on porous nickel support for hydrogen separation
Ryi SK, Park JS, Kim SH, Cho SH, Kim DW, Um KY
Separation and Purification Technology, 50(1), 82, 2006