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| No. | Article |
|---|---|
| 1 |
Plating Uniformity of Bottom-up Copper Pillars and Patterns for IC Substrates with Additive-assisted Electrodeposition Chen YM, He W, Chen XM, Wang C, Tao ZH, Wang SX, Zhou GY, Moshrefi-Torbati M Electrochimica Acta, 120, 293, 2014 |