화학공학소재연구정보센터
검색결과 : 7건
No. Article
1 Wet-chemical etching of metals for advanced semiconductor technology nodes: Ru etching in acidic Ce4+ solutions
Philipsen H, Mouwen N, Teck S, Monnens W, Le QT, Holsteyns F, Struyf H
Electrochimica Acta, 306, 285, 2019
2 Immersion and electrochemical deposition of Ru on Si
Philipsen H, Monnens W
Electrochimica Acta, 274, 306, 2018
3 Nucleation and growth kinetics of electrodeposited Ni films on Si(100) surfaces
Philipsen H, Jehoul H, Inoue F, Vandersmissen K, Yang L, Struyf H, van Dorp D
Electrochimica Acta, 230, 407, 2017
4 Nucleation Kinetics of Electroless Cu Deposition on Ruthenium Using Glyoxylic Acid as a Reducing Agent
Inoue F, Philipsen H, van der Veen MH, Van Huylenbroeck S, Armini S, Struyf H, Tanaka T
Journal of the Electrochemical Society, 161(14), D768, 2014
5 Electroless Cu deposition on atomic layer deposited Ru as novel seed formation process in through-Si vias
Inoue F, Philipsen H, Radisic A, Armini S, Civale Y, Leunissen P, Kondo M, Webb E, Shingubara S
Electrochimica Acta, 100, 203, 2013
6 Electroless Copper Bath Stability Monitoring with UV-VIS Spectroscopy, pH, and Mixed Potential Measurements
Inoue F, Philipsen H, Radisic A, Armini S, Civale Y, Shingubara S, Leunissen P
Journal of the Electrochemical Society, 159(7), D437, 2012
7 Void-Free Filling of HAR TSVs Using a Wet Alkaline Cu Seed on CVD Co as a Replacement for PVD Cu Seed
Armini S, El-Mekki Z, Vandersmissen K, Philipsen H, Rodet S, Honore M, Radisic A, Civale Y, Beyne E, Leunissen L
Journal of the Electrochemical Society, 158(2), H160, 2011