검색결과 : 12건
| No. | Article |
|---|---|
| 1 |
DFT Studies on Thermal and Oxidative Degradation of Monoethanolamine Parks C, Alborzi E, Akram M, Pourkashanian M Industrial & Engineering Chemistry Research, 59(34), 15214, 2020 |
| 2 |
Impurities in the Electroplated sub-50 nm Cu Lines: The Effects of the Plating Additives Huang Q, Avekians A, Ahmed S, Parks C, Baker-O'Neal B, Kitayaporn S, Sahin A, Sun Y, Cheng T Journal of the Electrochemical Society, 161(9), D388, 2014 |
| 3 |
Electrodeposited Cu Film Morphology on Thin PVD Cu Seed Layers Kelly J, Lin X, Nogami T, van der Straten O, Demarest J, Li J, Murphy R, Zhang X, Penny C, Parks C, Edelstein D Journal of the Electrochemical Society, 160(12), D3171, 2013 |
| 4 |
Leveler Effect and Oscillatory Behavior during Copper Electroplating Huang Q, Baker-O'Neal BC, Parks C, Hopstaken M, Fluegel A, Emnet C, Arnold M, Mayer D Journal of the Electrochemical Society, 159(9), D526, 2012 |
| 5 |
Electrolyte Additive Chemistry and Feature Size-Dependent Impurity Incorporation for Cu Interconnects Kelly J, Nogami T, van der Straten O, Demarest J, Li J, Penny C, Vo T, Parks C, Dehaven P, Hu CK, Liniger E Journal of the Electrochemical Society, 159(10), D563, 2012 |
| 6 |
Enumeration of aromatic oxygenase genes to evaluate biodegradation during multi-phase extraction at a gasoline-contaminated site Baldwin BR, Nakatsu CH, Nebe J, Wickham GS, Parks C, Nies L Journal of Hazardous Materials, 163(2-3), 524, 2009 |
| 7 |
Influence of plating parameters and solution chemistry on the voiding propensity at electroplated copper-solder interface Liu Y, Wang J, Yin L, Kondos P, Parks C, Borgesen P, Henderson DW, Cotts EJ, Dimitrov N Journal of Applied Electrochemistry, 38(12), 1695, 2008 |
| 8 |
Fluorine Diffusion from Fluorosilicate Glass Shapiro MJ, Matsuda T, Nguyen SV, Parks C, Dziobkowski C Journal of the Electrochemical Society, 143(7), L156, 1996 |
| 9 |
Impact of Reactive Ion Etching Induced Carbon Contamination on Oxidation of Silicon Tsuchiaki M, Kvitek RJ, Parks C, Murphy RJ, Ohiwa T, Watanabe T Journal of the Electrochemical Society, 143(7), 2378, 1996 |
| 10 |
Evaluation of Barriers for B-Diffusion and P-Diffusion into as-Doped Polysilicon Naeem MD, Parks C, Wangemann K, Glawischnig H Thin Solid Films, 290-291, 485, 1996 |