| 1 |
Failure mechanism of Ag-4Pd alloy wire bonded on Al-Si metallization under high temperature storage and thermal cycle tests in corrosive environments
Wang JN, Tsau YW, Ouyang FY
Materials Chemistry and Physics, 218, 147, 2018 |
| 2 |
Effect of Ag3Sn: Effective suppression of thermomigration-induced Cu dissolution in micro-scale Pb-free interconnects
Hsu WN, Ouyang FY
Materials Chemistry and Physics, 165, 66, 2015 |
| 3 |
Enhanced corrosion resistance of TiN-coated stainless steels for the application in flexible dye-sensitized solar cells
Ouyang FY, Tai WL
Applied Surface Science, 276, 563, 2013 |
| 4 |
Enhanced photovoltaic performance and long-term stability of dye-sensitized solar cells by incorporating SiO2 nanoparticles in binary ionic liquid electrolytes
Lee HF, Wu JL, Hsu PY, Tung YL, Ouyang FY, Kai JJ
Thin Solid Films, 529, 2, 2013 |
| 5 |
Efficient, stable, and flexible dye-sensitized solar cells based on nanocomposite gel electrolytes
Lee HF, Chua YT, Yang SM, Hsu PY, Ouyang FY, Tung YL, Kai JJ
Thin Solid Films, 544, 301, 2013 |
| 6 |
A comparative study of charge transport in quasi-solid state dye-sensitized solar cells using polymer or nanocomposite gel electrolytes
Lee HF, Kai JJ, Liu PC, Chang WC, Ouyang FY, Chan HT
Journal of Electroanalytical Chemistry, 687, 45, 2012 |
| 7 |
Effect of electromigration induced joule heating and strain on microstructural recrystallization in eutectic SnPb flip chip solder joints
Ouyang FY, Tu KN, Lai YS
Materials Chemistry and Physics, 136(1), 210, 2012 |
