| 1 |
Effects of Electroplating at Lower Leveler and Suppressor Contents on the Formation of Very Low Resistivity Narrow Cu Interconnects
Miyamoto R, Tamahashi K, Inami T, Sasajima Y, Onuki J
Journal of the Electrochemical Society, 166(4), D137, 2019 |
| 2 |
Impact of Electroplating at Lower Leveler Content on the Formation of Low Resistivity Narrow Cu Interconnects
Inami T, Miyamoto R, Tamahashi K, Namekawa T, Ishikawa N, Ito M, Onuki J
Journal of the Electrochemical Society, 164(7), D505, 2017 |
| 3 |
Screening of Undesirable Elements Raising the Electrical Resistivity in Very Narrow Cu Wires by Ab Initio Calculation
Nagano T, Tamahashi K, Inami T, Sasajima Y, Onuki J
Journal of the Electrochemical Society, 164(9), D558, 2017 |
| 4 |
Characterization of high-dose and high-energy implanted gate and source diode and analysis of lateral spreading of p gate profile in high voltage SiC static induction transistors
Onose H, Kobayashi Y, Onuki J
Solid-State Electronics, 129, 200, 2017 |
| 5 |
Resistivity Reduction in Very Narrow Cu Wiring
Onuki J, Sasajima Y, Tamahashi K, Ke YQ, Terada S, Hidaka K, Itoh S
Journal of the Electrochemical Society, 160(12), D3266, 2013 |
| 6 |
Electron backscatter diffraction analysis of electrodeposited nano-scale copper wires
Ke Y, Konkova T, Mironov S, Tamahashi K, Onuki J
Thin Solid Films, 539, 207, 2013 |
| 7 |
Texture and Grain Size Investigation in the Copper Plated Through-Silicon via for Three-Dimensional Chip Stacking Using Electron Backscattering Diffraction
Kadota H, Kanno R, Ito M, Onuki J
Electrochemical and Solid State Letters, 14(5), D48, 2011 |
| 8 |
Development of a Nondestructive Method Utilizing X-ray Diffraction for the Evaluation of Grain Size Distributions of Cu Interconnects
Inami T, Onuki J, Isshiki M
Electrochemical and Solid State Letters, 14(5), H208, 2011 |
| 9 |
Substrate temperature dependence of electrical and structural properties of Ru films
Nagano T, Inokuchi K, Tamahashi K, Ishikawa N, Sasajima Y, Onuki J
Thin Solid Films, 520(1), 374, 2011 |
| 10 |
Effect of the Purity of Plating Materials on the Reduction of Resistivity of Cu wires for Future LSIs
Onuki J, Tashiro S, Khoo K, Ishikawa N, Kimura T, Chonan Y, Akahoshi H
Journal of the Electrochemical Society, 157(9), II857, 2010 |
