검색결과 : 1건
| No. | Article |
|---|---|
| 1 |
Finite element analysis for microwave cure of underfill in flip chip packaging Liu L, Yi S, Ong LS, Chian KS Thin Solid Films, 462-63, 436, 2004 |
| No. | Article |
|---|---|
| 1 |
Finite element analysis for microwave cure of underfill in flip chip packaging Liu L, Yi S, Ong LS, Chian KS Thin Solid Films, 462-63, 436, 2004 |