검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
The Impact of Organic Additives on Copper Trench Microstructure Marro JB, Okoro CA, Obeng YS, Richardson KC Journal of the Electrochemical Society, 164(9), D543, 2017 |
| 2 |
The influence of pulse plating frequency and duty cycle on the microstructure and stress state of electroplated copper films Marro JB, Darroudi T, Okoro CA, Obeng YS, Richardson KC Thin Solid Films, 621, 91, 2017 |
| 3 |
A case study on the impact of local material chemistry on the mechanical reliability of packaged integrated circuits: Correlation of the packaging fallout to the chemistry of passivation dielectrics Okoro CA, Obeng YS Thin Solid Films, 520(15), 5060, 2012 |