화학공학소재연구정보센터
검색결과 : 6건
No. Article
1 An experimental investigation of bonding strengths for plasma facing components
Jiang J, Zhang QL, Shen WP
International Journal of Energy Research, 42(3), 1013, 2018
2 Cylinder Test Correction for Copper Work Hardening and Spall
Souers PC, Minich R
Propellants Explosives Pyrotechnics, 40(2), 238, 2015
3 Thermal gap conductance at low contact pressures (< 1 MPa): Effect of gold plating and plating thickness
Misra P, Nagaraju J
International Journal of Heat and Mass Transfer, 53(23-24), 5373, 2010
4 Deformation and recrystallization texture of heavily drawn OFHC copper
Waryoba DR, Kalu PN
Materials Science Forum, 495-497, 877, 2005
5 Textural and microstructural inhomogeneities in drawn and annealed OFHC copper wire
Waryoba DR, Kalu PN
Materials Science Forum, 495-497, 895, 2005
6 Secondary electron emission data of cesiated oxygen free high conductivity copper(II)
Hopman HJ, Zeijlemaker H, Verhoeven J
Applied Surface Science, 171(3-4), 197, 2001