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Nickel hexacyanoferrate flower-like nanosheets coated three dimensional porous nickel films as binder-free electrodes for neutral electrolyte supercapacitors Jiang H, Xu YT, Wang T, Zhu PL, Yu SH, Yu Y, Fu XZ, Sun R, Wong CP Electrochimica Acta, 166, 157, 2015 |
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Rapid-Thermal Pulse 화학증착법에 의해 증착된 그래핀 박막에서 촉매금속 Ni의 두께 및 열처리 조건의 영향 나신혜, 윤순길 Korean Journal of Materials Research, 21(2), 78, 2011 |
3 |
Interfacial reactions of electroless nickel thin films on silicon Liu CM, Liu WL, Hsieh SH, Tsai TK, Chen WJ Applied Surface Science, 243(1-4), 259, 2005 |
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Intrinsic coercivities of molecular beam epitaxy grown single-crystal Ni films on Ag buffer layer Jen SU, Wu TC, Yu CC Applied Surface Science, 252(5), 1934, 2005 |
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Effect of interfacial mixing by N+ implantation on the adhesion and friction of Ti film on Si3N4 Tian J, Wang QZ, Chen YF, Yu LG, Wang LJ, Xue QJ Journal of Adhesion Science and Technology, 12(10), 1071, 1998 |
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Improvement in the adhesion between copper metal and polyimide substrate by plasma polymer deposition of cyano compounds onto polyimide Inagaki N, Tasaka S, Ohmori H, Mibu S Journal of Adhesion Science and Technology, 10(3), 243, 1996 |
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Improved Adhesion Between Kapton Film and Copper Metal by Plasma Graft-Polymerization of Vinylimidazole Inagaki N, Tasaka S, Masumoto M Macromolecules, 29(5), 1642, 1996 |
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Plasma Graft-Polymerization of Vinylimidazole Onto Kapton Film Surface for Improvement of Adhesion Between Kapton Film and Copper Inagaki N, Tasaka S, Masumoto M Journal of Applied Polymer Science, 56(2), 135, 1995 |
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IMPROVED ADHESION BETWEEN PLASMA-TREATED POLYIMIDE FILM AND EVAPORATED COPPER INAGAKI N, TASAKA S, HIBI K Journal of Adhesion Science and Technology, 8(4), 395, 1994 |
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Interfacial Reactions in Dynamically Heated Si/Me/Si Sandwich Layers Zalar A, Hofmann S, Pimentel F, Panjan P Thin Solid Films, 253(1-2), 293, 1994 |