화학공학소재연구정보센터
검색결과 : 3건
No. Article
1 Silane Decomposition on Cu Interconnects Inhibited by Ammonia
Ryan ET, Molis S, Grill A
Journal of the Electrochemical Society, 157(1), H78, 2010
2 Methods of producing plasma enhanced chemical vapor deposition silicon nitride thin films with high compressive and tensile stress
Belyansky M, Chace M, Gluschenkov O, Kempisty J, Klymko N, Madan A, Mallikarjunan A, Molis S, Ronsheim P, Wang Y, Yang D, Li Y
Journal of Vacuum Science & Technology A, 26(3), 517, 2008
3 Line resistance and electromigration variations induced by hydrogen-based plasma modifications to the silicon carbonitride/copper interface
Ryan ET, Martin J, Bonilla G, Molis S, Spooner T, Widodo J, Kim JH, Liniger E, Grill A, Hu CK
Journal of the Electrochemical Society, 154(7), H604, 2007