화학공학소재연구정보센터
검색결과 : 21건
No. Article
1 Analyses of Diamond Disk Substrate Wear and Diamond Microwear in Copper Chemical Mechanical Planarization Process
Meled A, Zhuang Y, Wei X, Cheng J, Sampurno YA, Borucki L, Moinpour M, Hooper D, Philipossian A
Journal of the Electrochemical Society, 157(3), H250, 2010
2 Oxygen plasma damage to blanket and patterned ultralow-kappa surfaces
Bao J, Shi H, Huang H, Ho PS, McSwiney ML, Goodner MD, Moinpour M, Kloster GM
Journal of Vacuum Science & Technology A, 28(2), 207, 2010
3 Copper CMP with Composite Polymer Core-Silica Shell Abrasives: A Defectivity Study
Armini S, Whelan CM, Moinpour M, Maex K
Journal of the Electrochemical Society, 156(1), H18, 2009
4 Controlling Scratching in Cu Chemical Mechanical Planarization
Eusner T, Saka N, Chun JH, Armini S, Moinpour M, Fischer P
Journal of the Electrochemical Society, 156(7), H528, 2009
5 Synchronous, In Situ Measurements in Chemical Mechanical Planarization
Vlahakis J, Rogers C, Manno VP, White R, Moinpour M, Hooper D, Anjur S
Journal of the Electrochemical Society, 156(10), H794, 2009
6 In Situ Investigation of Slurry Flow Fields during CMP
Mueller N, Rogers C, Manno VP, White R, Moinpour M
Journal of the Electrochemical Society, 156(12), H908, 2009
7 Mixed organic/inorganic abrasive particles during oxide CMP
Armini S, Whelan CM, Moinpour M, Maex K
Electrochemical and Solid State Letters, 11(7), H197, 2008
8 Interaction forces between a glass surface and ceria-modified PMMA-Based abrasives for CMP measured by colloidal probe AFM
Armini S, Burtovyy R, Moinpour M, Luzinov I, De Messemaeker J, Whelan CM, Maex K
Journal of the Electrochemical Society, 155(4), H218, 2008
9 Composite polymer core-silica shell abrasives: The effect of the shape of the silica particles on oxide CMP
Armini S, Whelan CM, Moinpour M, Maex K
Journal of the Electrochemical Society, 155(6), H401, 2008
10 Composite polymer core-ceria shell abrasive particles during oxide CMP: A defectivity study
Armini S, De Messemaeker J, Whelan CM, Moinpour M, Maex K
Journal of the Electrochemical Society, 155(9), H653, 2008