검색결과 : 4건
| No. | Article |
|---|---|
| 1 |
Effects of CMP process conditions on defect generation in low-k materials - An atomic force microscopy study Chandrasekaran N, Ramarajan S, Lee W, Sabde GM, Meikle S Journal of the Electrochemical Society, 151(12), G882, 2004 |
| 2 |
Modeling of chemical mechanical polishing processes using a discretized geometry approach Yao CH, Feke DL, Robinson KM, Meikle S Journal of the Electrochemical Society, 147(4), 1502, 2000 |
| 3 |
The influence of feature-scale surface geometry on CMP processes Yao CH, Feke DL, Robinson KM, Meikle S Journal of the Electrochemical Society, 147(8), 3094, 2000 |
| 4 |
Inhibition of alumina deposition during tungsten chemical mechanical planarization through the use of citric acid Zhang L, Raghavan S, Meikle S, Hudson G Journal of the Electrochemical Society, 146(4), 1442, 1999 |