검색결과 : 6건
| No. | Article |
|---|---|
| 1 |
Cu Electrochemical Mechanical Planarization Surface Quality Tripathi A, Suni II, Li YZ, Doniat F, McAndrew J Journal of the Electrochemical Society, 156(7), H555, 2009 |
| 2 |
Electrolyte composition for Cu electrochemical mechanical planarization Tripathi A, Burkhard C, Suni II, Li YZ, Doniat F, Barajas A, McAndrew J Journal of the Electrochemical Society, 155(11), H918, 2008 |
| 3 |
Atomic layer deposition of lanthana thin films using high-purity lanthanum amino precursors Inman R, Schuetz SA, Silvernail CM, Balaz S, Dowben PA, Jursich G, McAndrew J, Belot JA Materials Chemistry and Physics, 104(2-3), 220, 2007 |
| 4 |
Novel electroplanarization system for replacement of CMP Huo J, Solanki R, McAndrew J Electrochemical and Solid State Letters, 8(2), C33, 2005 |
| 5 |
Atomic layer deposition of lanthanum oxide films for high-kappa gate dielectrics He WM, Schuetz S, Solanki R, Belot J, McAndrew J Electrochemical and Solid State Letters, 7(7), G131, 2004 |
| 6 |
Study of anodic layers and their effects on electropolishing of bulk and electroplated films of copper Huo J, Solanki R, McAndrew J Journal of Applied Electrochemistry, 34(3), 305, 2004 |