화학공학소재연구정보센터
검색결과 : 4건
No. Article
1 Properties of deep etched trenches in silicon: Role of the angular dependence of the sputtering yield and the etched species redeposition
Marcos G, Rhallabi A, Ranson P
Applied Surface Science, 254(11), 3576, 2008
2 Chemically assisted ion beam etching of GaAs by argon and chlorine gases: Experimental and simulation investigations
Rhallabi A, Gaillard M, Elmonser L, Marcos G, Talneau A, Pommereau F, Pagnod-Rossiaux P, Landesman JP, Bouadma N
Journal of Vacuum Science & Technology B, 23(5), 1984, 2005
3 Topographic and kinetic effects of the SF6/O-2 rate during a cryogenic etching process of silicon
Marcos G, Rhallabi A, Ranson P
Journal of Vacuum Science & Technology B, 22(4), 1912, 2004
4 Monte Carlo simulation method for etching of deep trenches in Si by a SF6/O-2 plasma mixture
Marcos G, Rhallabi A, Ranson P
Journal of Vacuum Science & Technology A, 21(1), 87, 2003