검색결과 : 10건
| No. | Article |
|---|---|
| 1 |
Cu electrodeposition on Ru(0001): Perchlorate dissociation and its effects on Cu deposition Lei J, Rudenja S, Magtoto N, Kelber JA Thin Solid Films, 497(1-2), 121, 2006 |
| 2 |
The effects of an iodine surface layer on Ru reactivity in air and during Cu electrodeposition Liu J, Lei J, Magtoto N, Rudenja S, Garza M, Kelber JA Journal of the Electrochemical Society, 152(2), G115, 2005 |
| 3 |
Tetrakis(diethylamido) titanium (TDEAT) interactions with SiO2 and Cu substrates Tong J, Magtoto N, Kelber J Applied Surface Science, 220(1-4), 203, 2003 |
| 4 |
Ta metallization of Si-O-C substrate and Cu metallization of Ta/Si-O-C multilayer Tong J, Martini D, Magtoto N, Kelber J Journal of Vacuum Science & Technology B, 21(1), 293, 2003 |
| 5 |
Copper metallization of hydroxyl-modified amorphous Si : C : H films Pritchett M, Magtoto N, Tong J, Kelber JA, Zhao X Thin Solid Films, 440(1-2), 100, 2003 |
| 6 |
Electrodeposition of adherent copper film on unmodified tungsten Wang C, Lei JP, Bjelkevig C, Rudenja S, Magtoto N, Kelber J Thin Solid Films, 445(1), 72, 2003 |
| 7 |
Interaction of polymeric Si : C : H films with copper substrates and with deposited Cu adatoms Tong J, Martini D, Magtoto N, Pritchett M, Kelber J Applied Surface Science, 187(3-4), 253, 2002 |
| 8 |
Seedless electrodeposition of Cu on unmodified tungsten Wang C, Lei JP, Rudenja S, Magtoto N, Kelber J Electrochemical and Solid State Letters, 5(9), C82, 2002 |
| 9 |
Cu wetting and interfacial stability on clean and nitrided tungsten surfaces Ekstrom BM, Lee S, Magtoto N, Kelber JA Applied Surface Science, 171(3-4), 275, 2001 |
| 10 |
Effect of surface impurities on the Cu/Ta interface Chen L, Magtoto N, Ekstrom B, Kelber J Thin Solid Films, 376(1-2), 115, 2000 |