검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Selective and Blanket Electroless Copper Deposition for Ultralarge Scale Integration Dubin VM, Shachamdiamand Y, Zhao B, Vasudev PK, Ting CH Journal of the Electrochemical Society, 144(3), 898, 1997 |
| 2 |
Direct Nickel-Plating on Aluminum Substrate for Microbump Formation Honma H, Watanabe H, Kobayashi T Journal of the Electrochemical Society, 141(7), 1791, 1994 |