검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Use of Sibn and Sibon Films Prepared by Plasma-Enhanced Chemical-Vapor-Deposition from Borazine as Interconnection Dielectrics Kane WF, Cohen SA, Hummel JP, Luther B, Beach DB Journal of the Electrochemical Society, 144(2), 658, 1997 |
| 2 |
Copper Interconnection Integration and Reliability Hu CK, Luther B, Kaufman FB, Hummel J, Uzoh C, Pearson DJ Thin Solid Films, 262(1-2), 84, 1995 |