화학공학소재연구정보센터
검색결과 : 3건
No. Article
1 Trimethylchlorosilane treatment of ultralow dielectric constant material after photoresist removal processing
Chang TC, Mor YS, Liu PT, Tsai TM, Chen CW, Chu CJ, Pan FM, Lur W, Sze SM
Journal of the Electrochemical Society, 149(10), F145, 2002
2 Effective repair to ultra-low-k dielectric material (k-2.0) by hexamethyidisilazane treatment
Mor YS, Chang TC, Liu PT, Tsai TM, Chen CW, Yan ST, Chu CJ, Wu WF, Pan FM, Lur W, Sze SM
Journal of Vacuum Science & Technology B, 20(4), 1334, 2002
3 Effects of a new combination of additives in electroplating solution on the properties of Cu films in ULSI applications
Hu JC, Chang TC, Wu CW, Chen LJ, Hsiung CS, Hsieh WY, Lur W, Yew TR
Journal of Vacuum Science & Technology A, 18(4), 1207, 2000