검색결과 : 1건
| No. | Article |
|---|---|
| 1 |
Wafer scale packaging of MEMS by using plasma-activated wafer bonding Suni T, Henttinen K, Lipsanen A, Dekker J, Luoto H, Kulawski M Journal of the Electrochemical Society, 153(1), G78, 2006 |
| No. | Article |
|---|---|
| 1 |
Wafer scale packaging of MEMS by using plasma-activated wafer bonding Suni T, Henttinen K, Lipsanen A, Dekker J, Luoto H, Kulawski M Journal of the Electrochemical Society, 153(1), G78, 2006 |