화학공학소재연구정보센터
검색결과 : 13건
No. Article
1 Interfacial effects in ZnO nanotubes/needle-structured graphitic diamond nanohybrid for detecting dissolved acetone at room temperature
Kathiravan D, Huang BR, Saravanan A, Yeh CJ, Leou KC, Lin IN
Applied Surface Science, 426, 630, 2017
2 Improving discharge uniformity of industrial-scale very high frequency plasma sources by launching a traveling wave
Chen HL, Tu YC, Hsieh CC, Lin DL, Chang CJ, Leou KC
Current Applied Physics, 16(7), 700, 2016
3 Assessment of interface roughness during plasma etching through the use of real-time ellipsometry
Han CY, Lai CW, Chao YF, Leou KC, Lin TL
Applied Surface Science, 257(7), 2536, 2011
4 Feedback control of plasma electron density and ion energy in an inductively coupled plasma etcher
Lin C, Leou KC, Huang HM, Hsieh CH
Journal of Vacuum Science & Technology A, 27(1), 157, 2009
5 Feedback control of HfO2 etch processing in inductively coupled Cl-2/N-2/Ar plasmas
Lin C, Leou KC, Li TC, Lee LS, Tzeng PJ
Journal of Vacuum Science & Technology A, 26(5), 1282, 2008
6 Effects of in situ N-2 plasma treatment on etch of HfO2 in inductively coupled Cl-2/N-2 plasmas
Lin C, Leou KC, Fan YC, Li TC, Chang KH, Lee LS, Tzeng PJ
Journal of Vacuum Science & Technology A, 25(3), 592, 2007
7 Large-scale growth of single-walled carbon nanotubes using cold-wall chemical vapor deposition
Shin KY, Lee CT, Kao JS, Kei CC, Chang CM, Hsiao CN, Liang JH, Leou KC, Tsai CH
Journal of Vacuum Science & Technology B, 25(6), 1842, 2007
8 Experimental characterization of an inductively coupled acetylene/hydrogen plasma for carbon nanofiber synthesis
Lin YY, Wei HW, Leou KC, Lin H, Tung CH, Wei MT, Lin C, Tsai CH
Journal of Vacuum Science & Technology B, 24(1), 97, 2006
9 Feedback control of chlorine inductively coupled plasma etch processing
Lin C, Leou KC, Shiao KM
Journal of Vacuum Science & Technology A, 23(2), 281, 2005
10 Real-time control of ion density and ion energy in chlorine inductively coupled plasma etch processing
Chang CH, Leou KC, Lin C, Lin TL, Tseng CW, Tsai CH
Journal of Vacuum Science & Technology A, 21(4), 1183, 2003