화학공학소재연구정보센터
검색결과 : 11건
No. Article
1 Feature evolution during plasma etching. II. Polycrystalline silicon etching
Lane JM, Klemens FP, Bogart KHA, Malyshev MV, Lee JTC
Journal of Vacuum Science & Technology A, 18(1), 188, 2000
2 Mask charging and profile evolution during chlorine plasma etching of silicon
Bogart KHA, Klemens FP, Malyshev MV, Colonell JI, Donnelly VM, Lee JTC, Lane JM
Journal of Vacuum Science & Technology A, 18(1), 197, 2000
3 The role of feedgas chemistry, mask material, and processing parameters in profile evolution during plasma etching of Si(100)
Lane JM, Bogart KHA, Klemens FP, Lee JTC
Journal of Vacuum Science & Technology A, 18(5), 2067, 2000
4 Mapping of wafer profile to plasma processing conditions: Forward and reverse maps
Lane J, Rietman EA, Layadi N, Lee JTC
Journal of Vacuum Science & Technology B, 18(1), 299, 2000
5 Role of sidewall scattering in feature profile evolution during Cl-2 and HBr plasma etching of silicon
Vyvoda MA, Li M, Graves DB, Lee H, Malyshev MV, Klemens FP, Lee JTC, Donnelly VM
Journal of Vacuum Science & Technology B, 18(2), 820, 2000
6 Langmuir probe studies of a transformer-coupled plasma, aluminum etcher
Malyshev MV, Donnelly VM, Kornblit A, Ciampa NA, Colonell JI, Lee JTC
Journal of Vacuum Science & Technology A, 17(2), 480, 1999
7 Dynamic images of plasma processes : Use of Fourier blobs for endpoint detection during plasma etching of patterned wafers
Rietman EA, Lee JTC, Layadi N
Journal of Vacuum Science & Technology A, 16(3), 1449, 1998
8 Effects of plasma conditions on the shapes of features etched in Cl-2 and HBr plasmas. I. Bulk crystalline silicon etching
Vyvoda MA, Lee H, Malyshev MV, Klemens FP, Cerullo M, Donnelly VM, Graves DB, Kornblit A, Lee JTC
Journal of Vacuum Science & Technology A, 16(6), 3247, 1998
9 Preliminary empirical results suggesting the mapping of dynamic in situ process signals to real-time wafer attributes in a plasma etch process
Rietman EA, Ibbotson DE, Lee JTC
Journal of Vacuum Science & Technology B, 16(1), 131, 1998
10 A new algorithm for real-time thin film thickness estimation given in situ multiwavelength ellipsometry using an extended Kalman filter
Galarza CG, Khargonekar PP, Layadi N, Vincent TL, Rietman EA, Lee JTC
Thin Solid Films, 313-314, 156, 1998