| 1 |
Determination of Redox Currents in Electroless Systems: Correct Application of Mixed Potential Analysis
Zeszut R, Landau U
Journal of the Electrochemical Society, 166(14), D737, 2019 |
| 2 |
Rapid screening of plating additives for bottom-up metallization of nano-scale features
Boehme L, Landau U
Journal of Applied Electrochemistry, 46(1), 39, 2016 |
| 3 |
Additives Co-Injection: A Test for Determining the Efficacy and Process Parameters of Bottom-up Plating
Boehme L, Landau U
Journal of the Electrochemical Society, 163(7), D314, 2016 |
| 4 |
Pulse Electrodeposition of Copper-Manganese Alloy for Application in Interconnect Metallization
Joi A, Akolkar R, Landau U
Journal of the Electrochemical Society, 160(12), D3145, 2013 |
| 5 |
Additives for Bottom-up Copper Plating from an Alkaline Complexed Electrolyte
Joi A, Akolkar R, Landau U
Journal of the Electrochemical Society, 160(12), D3001, 2013 |
| 6 |
Predictive Analytical Fill Model of Interconnect Metallization Providing Optimal Additives Concentrations
Adolf J, Landau U
Journal of the Electrochemical Society, 158(8), D469, 2011 |
| 7 |
Modeling the Current Distribution in Thin Electrolyte Films with Applications to Crevice Corrosion
Agarwal AS, Landau U, Payer JH
Journal of the Electrochemical Society, 157(1), C9, 2010 |
| 8 |
Mechanistic Analysis of the "Bottom-Up" Fill in Copper Interconnect Metallization
Akolkar R, Landau U
Journal of the Electrochemical Society, 156(9), D351, 2009 |
| 9 |
Polyether Suppressors Enabling Copper Metallization of High Aspect Ratio Interconnects
Mendez J, Akolkar R, Landau U
Journal of the Electrochemical Society, 156(11), D474, 2009 |
| 10 |
A mechanistic model for copper electropolishing in phosphoric acid
Mendez J, Akolkar R, Andryushchenko T, Landau U
Journal of the Electrochemical Society, 155(1), D27, 2008 |
