검색결과 : 1건
| No. | Article |
|---|---|
| 1 |
Effects of slurry flow rate and pad conditioning temperature on dishing, erosion, and metal loss during copper CMP Mudhivarthi S, Gitis N, Kuiry S, Vinogradov M, Kumar A Journal of the Electrochemical Society, 153(5), G372, 2006 |