화학공학소재연구정보센터
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No. Article
1 The Albicidin Resistance Factor AlbD Is a Serine Endopeptidase That Hydrolyzes Unusual Oligoaromatic-Type Peptides
Vieweg L, Kretz J, Pesic A, Kerwat D, Gratz S, Royer M, Cociancich S, Mainz A, Sussmuth RD
Journal of the American Chemical Society, 137(24), 7608, 2015
2 Detailed characterization of hydrogen silsesquioxane for e-beam applications in a dynamic random access memory pilot line environment
Keil K, Choi KH, Hohle C, Kretz J, Szikszai L, Bartha JW
Journal of Vacuum Science & Technology B, 27(1), 47, 2009
3 Resolution and total blur: Correlation and focus dependencies in e-beam lithography
Keil K, Hauptmann M, Kretz J, Constancias C, Pain L, Bartha JW
Journal of Vacuum Science & Technology B, 27(6), 2722, 2009
4 Evaluation of hybrid lithography and mix and match scenarios for electron beam direct write applications
Hohle C, Arndt C, Choi KH, Kretz J, Lutz T, Thrum F, Keil K
Journal of Vacuum Science & Technology B, 25(6), 2038, 2007
5 Influence of crystal orientation and body doping on trigate transistor performance
Landgraf E, Rosner W, Stadele M, Dreeskornfeld L, Hartwich J, Hofmann F, Kretz J, Lutz T, Luyken RJ, Schulz T, Specht M, Risch L
Solid-State Electronics, 50(1), 38, 2006
6 NVM based on FinFET device structures
Hofmann F, Specht M, Dorda U, Kommling R, Dreeskornfeld L, Kretz J, Stadele M, Rosner W, Risch L
Solid-State Electronics, 49(11), 1799, 2005
7 High-resolution scanning spreading resistance microscopy of surrounding-gate transistors
Alvarez D, Schomann S, Goebel B, Manger D, Schlosser T, Slesazeck S, Hartwich J, Kretz J, Eyben P, Fouchier M, Vandervorst W
Journal of Vacuum Science & Technology B, 22(1), 377, 2004
8 Impact of technology parameters on device performance of UTB-SOI CMOS
Schulz T, Pacha C, Luyken RJ, Stadele M, Hartwich J, Dreeskornfeld L, Landgraf E, Kretz J, Rosner W, Specht M, Hofmann F, Risch L
Solid-State Electronics, 48(4), 521, 2004
9 Nanoscale FinFETs for low power applications
Rosner W, Landgraf E, Kretz J, Dreeskornfeld L, Schafer H, Stadele M, Schulz T, Hofmann F, Luyken RJ, Specht M, Hartwich J, Pamler W, Risch L
Solid-State Electronics, 48(10-11), 1819, 2004
10 High precision etching of Si/SiO2 on a high-density helicon etcher for nanoscale devices
Dreeskornfeld L, Hartwich J, Kretz J, Schmitt-Landsiedel D, Loraine D, Powell K, Thomas DJ
Journal of the Electrochemical Society, 150(11), G702, 2003