1 |
The controllability of PbI2 morphology via nanorod-shaped underlying layer for solution-based perovskite two-step sequential deposition Kao SC, Chen YS, Lin PC, Ke SY, Wang CL Solar Energy, 211, 291, 2020 |
2 |
Interface characteristics of different bonded structures fabricated by low-temperature a-Ge wafer bonding and the application of wafer-bonded Ge/Si photoelectric device Ke SY, Ye YJ, Wu JY, Ruan YJ, Zhang XY, Huang W, Wang JY, Xu JF, Li C, Chen SY Journal of Materials Science, 54(3), 2406, 2019 |
3 |
Temperature-dependent interface characteristic of silicon wafer bonding based on an amorphous germanium layer deposited by DC-magnetron sputtering Ke SY, Lin SM, Ye YJ, Mao DF, Huang W, Xu JF, Li C, Chen SY Applied Surface Science, 434, 433, 2018 |
4 |
An analytical method for the field investigation of environmental amines released by industrial processes Wang CC, Sung LY, Wu PL, Ke SY, Ng SX, Jian RS, Lo EW, Lu CJ Process Safety and Environmental Protection, 102, 328, 2016 |
5 |
Morphological evolution of self-assembled SiGe islands based on a mixed-phase pre-SiGe island layer grown by ion beam sputtering deposition Ke SY, Ye S, Yang J, Wang ZQ, Wang C, Yang Y Applied Surface Science, 328, 387, 2015 |