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| No. | Article |
|---|---|
| 1 |
Inductively coupled, point-of-use plasma abatement of perfluorinated compounds and hydrofluorinated compounds from etch processes utilizing O-2 and H2O as additive gases Tonnis EJ, Graves DB, Vartanian VH, Beu L, Lii T, Jewett R Journal of Vacuum Science & Technology A, 18(2), 393, 2000 |