검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Effect of bath additives on copper electrodeposited directly on diffusion barrier for integrated silicon devices Im B, Kim S Thin Solid Films, 546, 263, 2013 |
| 2 |
An electrochemical and in situ SERS study of Cu electrodeposition from acidic sulphate solutions in the presence of 3-diethylamino-7-(4-dimethylaminophenylazo)-5-phenylphenazinium chloride (Janus Green B) Bozzini B, Mele C, D'urzo L, Romanello V Journal of Applied Electrochemistry, 36(9), 973, 2006 |