| 1 |
Bioinspired interfacial engineering of polymer based energetic composites towards superior thermal conductivity via reducing thermal resistance
He GS, Tian X, Dai Y, Li X, Lin CM, Yang ZJ, Liu SJ
Applied Surface Science, 493, 679, 2019 |
| 2 |
One-step photo-mediated grafting of poly(methyl methacrylate) onto fluorinated carbon nanotube for the enhanced thermal conductive property of polymer composites
Wang XW, Wu PY
Chemical Engineering Journal, 369, 272, 2019 |
| 3 |
Construction of 3D boron nitride nanosheets/silver networks in epoxy-based composites with high thermal conductivity via in-situ sintering of silver nanoparticles
Chen C, Xue Y, Li Z, Wen YF, Li XW, Wu F, Li XJ, Shi D, Xue ZG, Xie XL
Chemical Engineering Journal, 369, 1150, 2019 |
| 4 |
Effect of an interface layer on thermal conductivity of polymer composites studied by the design of double-layered and triple-layered composites
Song JN, Zhang Y
International Journal of Heat and Mass Transfer, 141, 1049, 2019 |
| 5 |
Photothermal nanobubble nucleation on a plasmonic nanoparticle: A 3D lattice Boltzmann simulation
Wang DM, Cheng P, Quan XJ
International Journal of Heat and Mass Transfer, 140, 786, 2019 |
| 6 |
Molecular dynamics study of thermal resistance of solid-liquid interface in contact with single layer of nanoparticles
Ueki Y, Miyazaki Y, Shibahara M, Ohara T
International Journal of Heat and Mass Transfer, 120, 608, 2018 |
| 7 |
Effect of CNT coating on the overall thermal conductivity of unidirectional polymer hybrid nanocomposites
Hassanzadeh-Aghdam MK, Mahmoodi MJ, Jamali J
International Journal of Heat and Mass Transfer, 124, 190, 2018 |
| 8 |
Theoretical and experimental study of a thermal damper based on a CNT/PCM composite structure for transient electronic cooling
Kinkelin C, Lips S, Soupremanien U, Remondiere V, Dijon J, Le Poche H, Oilier E, Zegaoui M, Rolland N, Rolland PA, Lhostis S, Descouts B, Kaplan Y, Lefevre F
Energy Conversion and Management, 142, 257, 2017 |
| 9 |
Molecular dynamics simulation of the interfacial thermal resistance between phosphorene and silicon substrate
Zhang JC, Hong Y, Liu MQ, Yue YN, Xiong QG, Lorenzini G
International Journal of Heat and Mass Transfer, 104, 871, 2017 |
| 10 |
Dropwise condensation heat transfer model considering the liquid-solid interfacial thermal resistance
Niu D, Guo L, Hu HW, Tang GH
International Journal of Heat and Mass Transfer, 112, 333, 2017 |
