| 1 |
Power Loss and Thermal Impedance Modeling of Multilevel Power Converter With Discontinuous Modulation
Islam MM, Rahman MA, Islam MR
IEEE Transactions on Energy Conversion, 36(1), 36, 2021 |
| 2 |
An Improved DC-Link Series IGBT Chopping Strategy for Brushless DC Motor Drive With Small DC-Link Capacitance
Zheng BN, Cao YF, Li XM, Shi TN
IEEE Transactions on Energy Conversion, 36(1), 242, 2021 |
| 3 |
A Universal Blocking-Module-Based Average Value Model of Modular Multilevel Converters With Different Types of Submodules
Meng XK, Han JT, Bieber LM, Wang LW, Li W, Belanger J
IEEE Transactions on Energy Conversion, 35(1), 53, 2020 |
| 4 |
Combining Detailed Equivalent Model With Switching-Function-Based Average Value Model for Fast and Accurate Simulation of MMCs
Meng XK, Han JT, Pfannschmidt J, Wang LW, Li W, Zhang F, Belanger J
IEEE Transactions on Energy Conversion, 35(1), 484, 2020 |
| 5 |
Optimal Design of a Converter-Machine System on a Load Profile Applied to a CAES System
Maisonnave O, Bernard N, Moreau L, Aubree R, Benkhoris MF, Neu T
IEEE Transactions on Energy Conversion, 34(4), 1839, 2019 |
| 6 |
Hot-carrier-induced current capability degradation and optimization for lateral IGBT on thick SOI substrate
Zhang CW, Li Y, Yue WJ, Fu XQ, Li ZM
Solid-State Electronics, 145, 34, 2018 |
| 7 |
The high temperature DC characteristics of a high voltage lateral insulated-gate bipolar transistors with NPN anode in junction isolation technology
Tsai YC, Gong J, Chan WC, Wu SY, Lien C
Solid-State Electronics, 132, 80, 2017 |
| 8 |
Automatic TCAD model calibration for multi-cellular Trench-IGBTs
Maresca L, Breglio G, Irace A
Solid-State Electronics, 91, 36, 2014 |
| 9 |
A novel BEM-LIGBT with high current density on thin SOI layer for 600 V HVIC
Zhu J, Sun WF, Chen J, Lu SL, Zhang S, Su W
Solid-State Electronics, 100, 33, 2014 |
| 10 |
Improving the Reactive Power Capability of the DFIG-Based Wind Turbine During Operation Around the Synchronous Speed
Sujod MZ, Erlich I, Engelhardt S
IEEE Transactions on Energy Conversion, 28(3), 736, 2013 |
