1 |
Bi-stage time evolution of nano-morphology on inductively coupled plasma etched fused silica surface caused by surface morphological transformation Jiang XL, Zhang LJ, Bai Y, Liu Y, Liu ZK, Qiu KQ, Liao W, Zhang CC, Yang K, Chen J, Jiang YL, Yuan XD Applied Surface Science, 409, 156, 2017 |
2 |
Optimum inductively coupled plasma etching of fused silica to remove subsurface damage layer Jiang XL, Liu Y, Liu ZK, Qiu KQ, Xu XD, Hong YL, Fu SJ Applied Surface Science, 355, 1180, 2015 |
3 |
Inductively coupled plasma etching of GaAs in Cl-2/Ar, Cl-2/Ar/O-2 chemistries with photoresist mask Liu K, Ren XM, Huang YQ, Cai SW, Duan XF, Wang Q, Kang C, Li JS, Chen QT, Fei JR Applied Surface Science, 356, 776, 2015 |
4 |
Fabrication of nanorod InGaN/GaN multiple self-assembled Ni nano-island masks quantum wells with Yang GF, Guo Y, Zhu HX, Yan DW, Li GH, Gao SM, Dong KX Applied Surface Science, 285, 772, 2013 |
5 |
Inductively coupled plasma etching to fabricate sensing window for polymer waveguide biosensor application Wang XB, Meng J, Sun XQ, Yang TF, Sun J, Chen CM, Zheng CT, Zhang DM Applied Surface Science, 259, 105, 2012 |
6 |
Antireflective properties of disordered Si SWSs with hydrophobic surface by thermally dewetted Pt nanomask patterns for Si-based solar cells Leem JW, Chung KS, Yu JS Current Applied Physics, 12(1), 291, 2012 |
7 |
Dry etching characteristics of TiN thin films in CF4/BCl3/N-2 plasma Joo YH, Woo JC, Kim CI Thin Solid Films, 520(6), 2339, 2012 |
8 |
Optimized inductively coupled plasma etching for poly(methyl-methacrylate-glycidly-methacrylate) optical waveguide Sun XQ, Li XD, Chen CM, Zhang K, Meng J, Wang XB, Yang TF, Zhang DM, Wang F, Xie ZY Thin Solid Films, 520(18), 5946, 2012 |
9 |
GaN etch rate and surface roughness evolution in Cl-2/Ar based inductively coupled plasma etching Rawal DS, Arora H, Agarwal VR, Vinayak S, Kapoor A, Sehgal BK, Muralidharan R, Saha D, Malik HK Thin Solid Films, 520(24), 7212, 2012 |
10 |
Improvement of the performance of GaN-based LEDs grown on sapphire substrates patterned by wet and ICP etching Gao HY, Yan FW, Zhang Y, Li JM, Zeng YP, Wang GH Solid-State Electronics, 52(6), 962, 2008 |