검색결과 : 11건
| No. | Article |
|---|---|
| 1 |
Component level modelling of heat transfer during vapour phase soldering with finite difference ADI approach Bozsoki I, Geczy A, Illes B International Journal of Heat and Mass Transfer, 128, 562, 2019 |
| 2 |
Numerical investigation on the effect of condensate layer formation around large-size components during vapour phase soldering Illes B, Geczy A, Krammer O, Dusek K, Busek D International Journal of Heat and Mass Transfer, 125, 202, 2018 |
| 3 |
Numerical modelling of the heat and mass transport processes in a vacuum vapour phase soldering system Illes B, Skwarek A, Geczy A, Krammer O, Busek D International Journal of Heat and Mass Transfer, 114, 613, 2017 |
| 4 |
Investigating condensation heat transfer during vapour phase soldering on round-shaped PCB plates Geczy A, Illes B, Darnai T International Journal of Heat and Mass Transfer, 86, 639, 2015 |
| 5 |
Numerical study of the gas flow velocity space in convection reflow oven Illes B, Bako I International Journal of Heat and Mass Transfer, 70, 185, 2014 |
| 6 |
Growth of intermetallics between Sn/Ni/Cu, Sn/Ag/Cu and Sn/Cu layered structures Horvath B, Illes B, Shinohara T Thin Solid Films, 556, 345, 2014 |
| 7 |
Modeling method of heat transfer during Vapour Phase Soldering based on filmwise condensation theory Geczy A, Illes B, Illyefalvi-Vitez Z International Journal of Heat and Mass Transfer, 67, 1145, 2013 |
| 8 |
Environmental Enrichment Decreases Asphyxia-Induced Neurobehavioral Developmental Delay in Neonatal Rats Kiss P, Vadasz G, Kiss-Illes B, Horvath G, Tamas A, Reglodi D, Koppan M International Journal of Molecular Sciences, 14(11), 22258, 2013 |
| 9 |
Copper-oxide whisker growth on tin-copper alloy coatings caused by the corrosion of Cu6Sn5 intermetallics Horvath B, Illes B, Shinohara T, Harsanyi G Journal of Materials Science, 48(23), 8052, 2013 |
| 10 |
Whisker growth on annealed and recrystallized tin platings Horvath B, Illes B, Shinohara T, Harsanyi G Thin Solid Films, 520(17), 5733, 2012 |