검색결과 : 4건
| No. | Article |
|---|---|
| 1 |
Effect of CMP slurry chemistry on copper nanohardness Ihnfeldt R, Talbot JB Journal of the Electrochemical Society, 155(6), H412, 2008 |
| 2 |
Modeling material removal rates for copper CMP using copper nanohardness and etch rates Ihnfeldt R, Talbot JB Journal of the Electrochemical Society, 155(8), H582, 2008 |
| 3 |
Modeling of copper CMP using the colloidal Behavior of an alumina slurry with copper nanoparticles Ihnfeldt R, Talbot JB Journal of the Electrochemical Society, 154(12), H1018, 2007 |
| 4 |
The effects of copper CMP slurry chemistry on the colloidal behavior of alumina abrasives Ihnfeldt R, Talbot JB Journal of the Electrochemical Society, 153(11), G948, 2006 |