검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Incorporation of Tin on copper clad laminate to increase the interface adhesion for signal loss reduction of high-frequency PCB lamination Wang C, Wen N, Zhou GY, Wang SX, He W, Su XH, Hu YS Applied Surface Science, 422, 738, 2017 |
| 2 |
Isoelectric points of viruses Michen B, Graule T Journal of Applied Microbiology, 109(2), 388, 2010 |