화학공학소재연구정보센터
검색결과 : 12건
No. Article
1 Cathodoluminescence of Cr-doped diamond-like carbon film by filtered cathodic vacuum arc plasma
Huang MW, Jao JY, Lin CC, Hsieh WJ, Yang YH, Cheng LS, Shieu FS, Shih HC
Applied Surface Science, 261, 21, 2012
2 Human DDA3 is an oncoprotein down-regulated by p53 and DNA damage
Hsieh WJ, Hsieh SC, Chen CC, Wang FF
Biochemical and Biophysical Research Communications, 369(2), 567, 2008
3 Embedded flexible micro-sensors in MEA for measuring temperature and humidity in a micro-fuel cell
Lee CY, Hsieh WJ, Wu GW
Journal of Power Sources, 181(2), 237, 2008
4 Thickness-dependent smectic-A - smectic-C* transition in chiral smectic free-standing liquid-crystal films
Pan TC, Hsieh WJ, Chao CY
Molecular Crystals and Liquid Crystals, 437, 1333, 2005
5 Thickness-dependent thermal behavior due to molecular tilt coupling strength in free-standing 70.7 thin films
Chao CY, Pan TC, Hsu MT, Hsieh WJ
Molecular Crystals and Liquid Crystals, 437, 1391, 2005
6 Characterization and formation of nanocrystalline diamonds in a-C/N films by filtered cathodic vacuum arc plasma
Hsieh WJ, Shih PS, Lin JH, Lin CC, Chen US, Huang SC, Chang YS, Shih HC
Thin Solid Films, 469-470, 120, 2004
7 Exploring metal vapor vacuum arc implanted copper to catalyze electroless-plated copper film on a TaN/FSG/Si assembly
Chen US, Lin JH, Hsieh WJ, Shih PS, Weng KW, Wang DY, Chang YS, Shih HC
Journal of Vacuum Science & Technology B, 21(3), 1129, 2003
8 In situ growing and etching of carbon nanotubes on silicon under microwave plasma
Tsai SH, Shiu CT, Lai SH, Chan LH, Hsieh WJ, Shih HC
Journal of Materials Science Letters, 21(21), 1709, 2002
9 Interfacial mechanism studies of electroless plated Cu films on a-Ta : N layers catalyzed by PIII
Lin JH, Lee TL, Hsieh WJ, Lin CC, Kou CS, Shih HC
Journal of Vacuum Science & Technology A, 20(3), 733, 2002
10 Gap-filling capability and adhesion strength of the electroless-plated copper for submicron interconnect metallization
Lin JH, Hsieh WJ, Hsu JW, Liu XW, Chen US, Shih HC
Journal of Vacuum Science & Technology B, 20(2), 561, 2002